Description: Brand New Sn62.8Pb36.8Ag0.4 (40G) 183 Melting Point Solder Paste, Soldering Paste For Electronic, PCB/Chip kit/IC/BGA/SMD Phone CPU Repairing Manufacturer model: SPA3684 Solder Paste Content: Alloy Tin 62.8% Pb 36.8%Ag0.4%, Solder Flux Content: 10.8%Lead-Containing Solder Paste - Medium Temperature Solder Paste With Flux, Melting Point: 183 C (361F)Pushing-Type Design Smoother Flowing No Wasting During WeldingWidely Used In Chip/BGA /SMD Circuit Board, Motors, Lighting, IC, TV and Other Household Appliances And Industrial Equipment, Sensors, Wires, Fuses, Phone, Metal Shells, Motors, Lighting, Connectors, ,SMT MaintenanceWarning:This Product Contains Lead, A Substance Known To The State Of California To Cause Cancer Or Birth DE-Fects Or Other Reproductive Toxicity. For More Information, Go To WWW.P65WARNINGS.CA.GOV Description Shipping and Handling Please allow 5-7 business days for the package to arrive, regardless of buyer location within the US. We will provide an online tracking number to you once the item has been shipped. It may take a few business days for our automated system to process the tracking number onto eBay. However, this will not affect the shipping times. Return Policy All our products are brand new and sealed. All items qualify for returns within 30 days of receipt. Feedback We take our reputation seriously. If you have any questions or concerns, please contact us and we will respond back to your message within 24 hours.
Price: 33.95 USD
Location: Within United States
End Time: 2024-03-14T02:21:28.000Z
Shipping Cost: 0 USD
Product Images
Item Specifics
Return shipping will be paid by: Seller
All returns accepted: Returns Accepted
Item must be returned within: 30 Days
Refund will be given as: Money Back
Return policy details:
EAN: Does not apply
MPN: SPA3684
UPC: Does not apply
Brand: Essmetuin
Color: 40g
