Description: In semiconductor manufacturing, understanding how various materials behave and interact is critical to making a reliable and robust semiconductor package. Semiconductor Packaging: Materials Interaction and Reliability provides a fundamental understanding of the underlying physical properties of the materials used in a semiconductor package. The book focuses on an important step in semiconductor manufacturing--package assembly and testing. It covers the basics of material properties and explains how to determine which behaviors are important to package performance. The authors also discuss how the properties of packaging materials interact with each another and explore how to maximize the performance of these materials in regard to package integrity and reliability. By tying together the disparate elements essential to a semiconductor package, this easy-to-read book shows how all the parts fit and work together to provide durable protection for the integrated circuit chip within as well as a means for the chip to communicate with the outside world.
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EAN: 9781439862056
UPC: 9781439862056
ISBN: 9781439862056
MPN: N/A
Book Title: Semiconductor Packaging: Materials Interaction and
Item Length: 23.1 cm
Number of Pages: 216 Pages
Language: English
Publication Name: Semiconductor Packaging: Materials Interaction and Reliability
Publisher: Taylor & Francis Inc
Publication Year: 2011
Item Height: 234 mm
Item Weight: 454 g
Type: Textbook
Author: Randy Hsiao-Yu Lo, Andrea Chen
Subject Area: Material Science, Mechanical Engineering
Item Width: 156 mm
Format: Hardcover
