Description: New Paperback
Price: 109.27 USD
Location: Sparks, Nevada
End Time: 2025-02-01T11:07:22.000Z
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Return shipping will be paid by: Buyer
All returns accepted: Returns Accepted
Item must be returned within: 30 Days
Refund will be given as: Money Back
Book Title: Semiconductor Packaging: Materials Interaction and Reliability
Publication Date: 2017-04-10
Item Length: 9.2in
Item Width: 6.1in
Author: Randy Hsiao-Yu Lo, Andrea Chen
Publication Name: Semiconductor Packaging : Materials Interaction and Reliability
Format: Trade Paperback
Language: English
Publisher: CRC Press LLC
Publication Year: 2017
Type: Textbook
Item Weight: 16 Oz
Number of Pages: 216 Pages
