Modeling And Design Of Electromagnetic Compatibility For High-Speed Printed...

Description: Please refer to the section BELOW (and NOT ABOVE) this line for the product details - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - Title:Modeling And Design Of Electromagnetic Compatibility For High-Speed Printed Circuit Boards And PackagingISBN13:9780367573669ISBN10:0367573660Author:Wei, Xing-Chang (Author)Description:Modeling And Design Of Electromagnetic Compatibility For High-Speed Printed Circuit Boards And Packaging Presents The Electromagnetic Modelling And Design Of Three Major Electromagnetic Compatibility (Emc) Issues Related To The High-Speed Printed Circuit Board (Pcb) And Electronic Packages: Signal Integrity (Si), Power Integrity (Pi), And Electromagnetic Interference (Emi) The Emphasis Is Put On Two Essential Passive Components Of Pcbs And Packages: The Power Distribution Network And The Signal Distribution Network This Book Includes Two Parts Part One Talks About The Field-Circuit Hybrid Methods Used For The Emc Modeling, Including The Modal Method, The Integral Equation Method, The Cylindrical Wave Expansion Method And The De-Embedding Method Part Two Illustrates Emc Design Methods And Explores The Applications Of Novel Metamaterials And Two-Dimensional Materials On Traditional Emc Problems This Book Is Designed To Enhance Worthwhile Electromagnetic Theory And Mathematical Methods For Practical Engineers And To Train Students With Advanced Emc Applications Binding:Paperback, PaperbackPublisher:CRC PressPublication Date:2020-07-02Weight:1.19 lbsDimensions:0.9'' H x 9.1'' L x 6.1'' WNumber of Pages:322Language:English

Price: 64.54 USD

Location: USA

End Time: 2025-02-03T17:43:13.000Z

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