Description: GaAs processing has reached a mature stage. New semiconductor compounds are emerging that will dominate future materials and device research, although the processing techniques used for GaAs will still remain relevant. This book covers all aspects of the current state of the art of III-V processing, with emphasis on HBTs. It is aimed at practicing engineers and graduate students and engineers new to the field of III-V semiconductor IC processing. The book's primary purpose is to discuss all aspects of processing of active and passive devices, from crystal growth to backside processing, including lithography, etching, and film deposition.
Price: 159 AUD
Location: Hillsdale, NSW
End Time: 2025-01-11T08:11:35.000Z
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EAN: 9789814669306
UPC: 9789814669306
ISBN: 9789814669306
MPN: N/A
Item Length: 22.9 cm
Number of Pages: 716 Pages
Language: English
Publication Name: III-V Integrated Circuit Fabrication Technology
Publisher: Pan Stanford Publishing Pte Ltd
Publication Year: 2016
Item Height: 229 mm
Item Weight: 1111 g
Type: Textbook
Author: Dhrubes Biswas, Shiban Tiku
Subject Area: Material Science, Mechanical Engineering
Item Width: 152 mm
Format: Hardcover
