Design For High Performance, Low Power, And Reliable 3D Integrated Circuits

Description: Please refer to the section BELOW (and NOT ABOVE) this line for the product details - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - - Title:Design For High Performance, Low Power, And Reliable 3D Integrated CircuitsISBN13:9781441995414ISBN10:1441995412Author:Lim, Sung Kyu (Author)Description:This Book Provides Readers With A Variety Of Algorithms And Software Tools, Dedicated To The Physical Design Of Through-Silicon-Via (Tsv) Based, Three-Dimensional Integrated Circuits It Describes Numerous Manufacturing-Ready Gdsii-Level Layouts Of Tsv-Based 3D Ics Developed With The Tools Covered In The Book This Book Will Also Feature Sign-Off Level Analysis Of Timing, Power, Signal Integrity, And Thermal Analysis For 3D Ic Designs Full Details Of The Related Algorithms Will Be Provided So That The Readers Will Be Able Not Only To Grasp The Core Mechanics Of The Physical Design Tools, But Also To Be Able To Reproduce And Improve Upon The Results Themselves This Book Will Also Offer Various Design-For-Manufacturability (Dfm), Design-For-Reliability (Dfr), And Design-For-Testability (Dft) Techniques That Are Considered Critical To The Physical Design Process Binding:Hardcover, HardcoverPublisher:SPRINGER NATUREPublication Date:2012-11-25Weight:1.95 lbsDimensions:1.4'' H x 9.2'' L x 6.4'' WNumber of Pages:560Language:English

Price: 159.35 USD

Location: USA

End Time: 2024-11-11T19:52:27.000Z

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