Description: Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications by Yosi Shacham-Diamand, Tetsuya Osaka, Madhav Datta, Takayuki Ohba Estimated delivery 3-12 business days Format Hardcover Condition Brand New Description In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. Publisher Description In Advanced ULSI interconnects – fundamentals and applications we bring a comprehensive description of copper-based interconnect technology for ultra-lar- scale integration (ULSI) technology for integrated circuit (IC) application. In- grated circuit technology is the base for all modern electronics systems. You can ?nd electronics systems today everywhere: from toys and home appliances to a- planes and space shuttles. Electronics systems form the hardware that together with software are the bases of the modern information society. The rapid growth and vast exploitation of modern electronics system create a strong demand for new and improved electronic circuits as demonstrated by the amazing progress in the ?eld of ULSI technology. This progress is well described by the famous "Moores law" which states, in its most general form, that all the metrics that describe integrated circuit performance (e. g. , speed, number of devices, chip area) improve expon- tially as a function of time. For example, the number of components per chip d- bles every 18 months and the critical dimension on a chip has shrunk by 50% every 2 years on average in the last 30 years. This rapid growth in integrated circuits te- nology results in highly complex integrated circuits with an increasing number of interconnects on chips and between the chip and its package. The complexity of the interconnect network on chips involves an increasing number of metal lines per interconnect level, more interconnect levels, and at the same time a reduction in the interconnect line critical dimensions. Details ISBN 0387958673 ISBN-13 9780387958675 Title Advanced Nanoscale ULSI Interconnects: Fundamentals and Applications Author Yosi Shacham-Diamand, Tetsuya Osaka, Madhav Datta, Takayuki Ohba Format Hardcover Year 2009 Pages 552 Edition 2009th Publisher Springer-Verlag New York Inc. GE_Item_ID:140611679; About Us Grand Eagle Retail is the ideal place for all your shopping needs! With fast shipping, low prices, friendly service and over 1,000,000 in stock items - you're bound to find what you want, at a price you'll love! Shipping & Delivery Times Shipping is FREE to any address in USA. Please view eBay estimated delivery times at the top of the listing. Deliveries are made by either USPS or Courier. We are unable to deliver faster than stated. International deliveries will take 1-6 weeks. NOTE: We are unable to offer combined shipping for multiple items purchased. This is because our items are shipped from different locations. Returns If you wish to return an item, please consult our Returns Policy as below: Please contact Customer Services and request "Return Authorisation" before you send your item back to us. Unauthorised returns will not be accepted. Returns must be postmarked within 4 business days of authorisation and must be in resellable condition. Returns are shipped at the customer's risk. We cannot take responsibility for items which are lost or damaged in transit. For purchases where a shipping charge was paid, there will be no refund of the original shipping charge. Additional Questions If you have any questions please feel free to Contact Us. Categories Baby Books Electronics Fashion Games Health & Beauty Home, Garden & Pets Movies Music Sports & Outdoors Toys
Price: 189.94 USD
Location: Fairfield, Ohio
End Time: 2025-01-25T01:26:46.000Z
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Restocking Fee: No
Return shipping will be paid by: Buyer
All returns accepted: Returns Accepted
Item must be returned within: 30 Days
Refund will be given as: Money Back
ISBN-13: 9780387958675
Book Title: Advanced Nanoscale ULSI Interconnects: Fundamentals and Applicat
Number of Pages: Xx, 552 Pages
Publication Name: Advanced Nanoscale Ulsi Interconnects : Fundamentals and Applications
Language: English
Publisher: Springer New York
Publication Year: 2009
Subject: Materials Science / General, Chemistry / Physical & Theoretical, Electronics / Circuits / Vlsi & Ulsi, Chemistry / Industrial & Technical
Type: Textbook
Item Weight: 39.5 Oz
Subject Area: Technology & Engineering, Science
Item Length: 9.3 in
Author: Tetsuya Osaka
Item Width: 6.1 in
Format: Hardcover
